Manual HB05 Wire Bonder manufactured by TPT Wire Bonder GmbH & Co. KG, is used for putting contacts on samples, chips and chip holders. It has the option of wedge and ball bonding.
Uža područja primjene
solid state physics, electronics
Namjena instrumenta
putting wire bonds
Project title
Collective effects, tunnelling and topological transport in novel nanojunctions
Year of manufacture
2017
Ustanova en
Sveučilište u Zagrebu, Prirodoslovno-matematički fakultet , Zagreb
